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Jetson AGX Industrial

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Brand : Nvidia

Model : Jetson AGX Industrial

Overview

NVIDIA® Jetson AGX Xavier™ Industrial is a form-factor and pin-compatible Jetson AGX Xavier series module that lets customers bring the latest AI models to their most demanding use cases. It comes with extended temperature, shock, and vibration specifications, new functional safety capabilities, new security features, and up to 20X the performance and 4X the memory of NVIDIA® Jetson™ TX2i.

For industrial automation, robotics, and other intelligent machine OEMs who want to create ruggedized and/or safety certified products, Jetson AGX Xavier Industrial delivers the highest performance for AI embedded industrial and functional safety applications in a power-efficient, rugged form factor.

180,000.00

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Description


Technical Specifications

GPU : NVIDIA Volta™ architecture with 512 NVIDIA® CUDA® cores and 64 Tensor cores 20 TOPS (INT8)

CPU : 8-core NVIDIA Carmel Arm®v8.2 64-bit CPU, 8MB L2 + 4MB L3

DL Accelerator : 2x NVDLA, 10 TOPS (INT8)

Vision Accelerator : 2x 7-Way VLIW Vision Processor

Safety Cluster Engine : Dual Arm® Cortex®-R5 in lockstep

Memory : 32GB 256-bit LPDDR4x (ECC support) 136.5GB/s

Storage : 64GB eMMC 5.1

CSI Camera : Up to 6 cameras (36 via virtual channels), 16 lanes MIPI CSI-2, D-PHY 1.2 (up to 40Gbps), C-PHY 1.1 (up to 62Gbps)

Video Encode : 2x 4K60 (H.265/H.264), 6x 4K30 (H.265/H.264), 12x 1080p60 (H.265/H.264), 24x 1080p30 (H.265/H.264)

Video Decode : 2x 8K30 (H.265), 4x 4K60 (H.265), 8x 4K30 (H.265), 18x 1080p60 (H.265), 36x 1080p30 (H.265), 24x 1080p30(H.264)

UPHY : 8x PCIe Gen4, 3x USB 3.1, Single Lane UFS

Networking : 10/100/1000 BASE-T Ethernet

Display : Three multi-mode DP 1.2a/e DP 1.4/HDMI 2.0 a/b

Other I/O : USB 2.0, UART, SPI, CAN, I2C, I2S, DMIC & DSPK, GPIOs

Power : 20W | 40W

Mechanical : 100mm x 87mm, 699 pin Molex Mirror Mezz Connector, Integrated Thermal Transfer Plate

 

Key Industrial Features

Shock : Operational: 50G, 11 ms, Half sine Non-operational: 140G, 2 ms, Half sine, 3-axis, FCT/DPA, extend to 340G

Vibration : Operational: 10-500 Hz, 5G RMS (random/sinusoidal) Non-operational: 10-1000 Hz, 3G RMS, 3-axis, FCT

Temperature : Operational: -40°C to 85°C at TTP

Humidity : Non-operational: 95% RH, -10°C to 65°C

Error-Correcting Code : DRAM and GPU ECC

Operating Lifetime : 10 Years

 

Key Safety Features

Safety Cluster Engine (SCE) : A dedicated ARM Cortex R5F lock-step subsystem for integrated fault detection.

In-System-Test (IST) : LBIST (Logic Built In Self Test) & MBIST (Memory Built In Self Test) for detecting permanent and latent failures.

Hardware Safety Manager (HSM) and Error Collator (EC) : For monitoring and reporting error signals

Support for adding external safety MCU : Interfaces to add external safety MCU

Reliability, Availability and Serviceability : ARM CCPLEX RAS


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